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Silicon Wafer Grinding Machine

Jan 01, 2005 K. Abe, S. Okawa, Y. Koma, K. Arai, Development of an ultraprecision grinding machine for super large and super flat silicon wafers proposal of trigonal prism type pentahedral structure, in Proceedings of Silicon Machining — Spring Topical Meeting, April 13–16, 1998, Carmel by the sea, CA, American Society for Precision Engineering.

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